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  • 苏州优利特电子



    苏州优利特电子科技有限公司通过投资专业化设备,擅长于对QFP零件引脚重整与BGA重新植球,避免零件报废。有价值的BGA (Ball Grid Array焊球阵列封装)与 QFP(方型扁平式封装技术)回收并重新应用于生产。
    Investment in specialist equipment capable of lead alignment and BGA reballing enables Suzhou Unit Electronics technology .,LTD to recover components which would otherwise be considered scrap.Valuable BGA & QFP line side spit-out recovered for use in production.


    • BGA重新植球 BGA reballing
    • QFP引脚修整 QFP Lead Alignment
    • 引脚镀层无铅转换SnPb Terminal Finish conversion to lead free
    • 零件整型Component Forming
    • 零件编程Component Programming
    • 自动检测并提供检测报告Automated inspection including report if requested
    • 烘烤Baking
    • 编带包装和卷带包装Tape and Reeling
    • 符合JEDEC标准的干燥包装 Dry packing in line with JEDEC Standard

    图1: 图2: 图3:


         Technical detail: The company policy is to automate processes wherever possible,
         this strategy enables a high level of consistency and repeatability on all processes。

    2,环境:依据ISO 9001:2000运 within ISO 9001:2000.
         Environment: Quality System operating within ISO 9001:2000.

         BGA Reballing: BGA components reballed using eutectic and non collapsible spheres.
         Various lead-free spheres available.

         Lead Alignment:QFP, SOIC component leads realigned using fully automated computer controlled equipment.
         Reworked and packaged to quality standards suitable for machine placement.

    5,引脚镀层无铅转换Pb-FREE TERMINAL FINISH CONVERSION 将有铅零件镀层转换为无铅镀层以符合RoHS指令
         Providing Second Level Inter-Connect SnPb Finish Conversion compliant with RoHS

    苏州优利特电子科技有限公司拥有成功转换BGA & QFP引脚镀层的丰富经验,并符合根据JEDEC StandardJESD97而制定的RoHS指令2002/95/EC。
    Suzhou Unit Electronics technology .,LTD has successfully changed the terminal finish on BGA and QFP components in line with RoHS directive2002/95/EC as defined by the Jedec Standards JESD97.

    6,烘烤条件:125摄氏度条件下烘烤24小时。或40摄氏度,相对湿度小于5%条件下烘烤192 小时。 (或按照规格书的规范)
         Baking Considerations: Components are baked at 125 deg C for 24 hours.
         Alternative is to bake at 40°C with less than 5% relative humidity for 192 hours.

    7,编带包装与卷带包装:依据EIA 418标准对产品进行料带包装。每个批次都将通过剥离测试。
         Tape and Reeling: Product taped to EIA 418 standard.Peel strength test completed on all batches.
         Capability to reel all package styles in volume and as component attrition. Special custom design service available.

         Dry Packing:ESD Bag. Humidity indicator card 4 Spot. Desiccant included in all MSL dry packing.
         Customised labelling available.

         Quality:ISO Certified,Full ESD Protected,Environment.
         Fully Traceable documentation. Integrated production control system.

    其他服务:元器件真伪判别:优利特为既有客户和合作伙伴提供此类增值服务。针对产品:有价值的BGA或其他相关元件, ALTERA(阿尔特拉) XILINX(塞灵思) 等FPGA 。客户对象:苏州优利特既有客户和合作伙伴,一般情况不对外,具体需要跟我司销售联系。